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DZ Series Spindle Oil

Dremfu DK-760M water-soluble cutting fluid is suitable for milling, rolling, rough grinding, fine grinding, edging, chamfering and other processing processes of hard and brittle non-metallic materials such as sapphire mirror, window piece and sapphire precision components.

Dk-760M Silicon Wafer Cutting Fluid

Silicon wafer cutting fluid DK-760M is suitable for various machining processes of semiconductor materials such as monocrystalline silicon, polycrystalline silicon, wafers, and ceramics, including milling, rolling, coarse grinding, fine grinding, edge grinding, and chamfering. It offers strong lubrication and cleaning penetration, effectively enhancing processing efficiency and being a reliable aid in your machining operations.

Dk-760D Silicon Wafer Wire Cutting Fluid

Silicon wafer wire cutting fluid DK-760D is used for diamond wire cutting of semiconductor materials like monocrystalline silicon, polycrystalline silicon, wafers, and ceramics. It is formulated with surfactants, lubricants, EP additives, and other auxiliaries, making it an environmentally friendly, fully synthetic wire cutting fluid.

Dk-760C6 Water-Soluble Grinding Fluid

Dremfu DK-760C6 water-soluble grinding fluid is prepared by a variety of surfactants, lubricants, anti-rust agents and other additives. It is suitable for wire-cut cooling processing of glass-ceramics, quartz, optical glass and other materials.

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Products

Products

DZ Series Spindle Oil

Dk-760M Silicon Wafer Cutting Fluid

Dk-760D Silicon Wafer Wire Cutting Fluid

Dk-760C6 Water-Soluble Grinding Fluid

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